AMD Strix Halo APU Leaks: RDNA 3.5 iGPU, 120W TDP, And Double the Size of Strix Point

Leaks about the AMD Strix Halo APU reveal exciting details, like an RDNA 3.5 iGPU, a 120W TDP, and a size that’s twice as big as Strix Point.

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AMD Strix Halo APU Leaks: RDNA 3.5 iGPU, 120W TDP, And Double the Size of Strix Point

The AMD Strix Halo APU is the next step from the Strix Point APU, not only in terms of size but also power. We’ve received fresh leaks from thermal engineer and specialist, Sam Jiun-Wei Hu, who has been involved in developing a new cooling system for the 2025 ASUS ROG Flow Z13 PC tablet. Actually, ‘tablet’ is a misnomer, because this device is part-tablet and part-laptop. It is also fitted with the AMD Strix Halo APU which is sure to take the performance through the roof.

But let us paint some backstory. APUs, or Accelerated Processing Units, are the combination of CPUs and GPUs, built into a single chip so that it can perform the general computation that a CPU does as well as handle graphic-intensive tasks that a GPU does.

Now, APUs are cheaper compared to buying separate CPUs and GPUs and they require much less space. That’s why they are used in small form factor devices, like laptops. However, APU’s capability is limited when it comes solely to graphic-intensive tasks or computation-intensive tasks. So if you want to do heavy video editing, you need to invest in a dedicated graphics card.

AMD Strix Halo APU Leaks

Let’s now come back to the matter at hand. According to the leaks, the AMD Strix Halo APU die sports three chiplets of which two are Zen 5 CCDs and the third is a GPU chip with the I/O and memory controllers. The Zen 5 measures 66.345 square millimeters, or 70.6 square millimeters with the die stiffeners. Each CCD fits 8-16 cores and 32 threads.

The iGPU, or the third GPU chip, measures 19.18 x 16.02 millimeters, which is equal to 307 square millimeters. For comparison’s sake, the Strix Point APU measures 232.5 square millimeters. The iGPU is almost as big as a dedicated GPU and the reason is that it has up to 40 RDNA 3.5 compute units. If the numbers are confusing, trust us when we tell you that the iGPU packs a serious punch.

If we measure the entire die, CCDs and iGPU combined, we get 24.0 x 19.78 millimeters which equals 475.31 square millimeters. This die is listed as the IOD with a hotspot temperature of 86.6C. Surprisingly, the RDNA 3.5 iGPU will consume more power and release more heat than the Zen 5 CCD.

AMD Strix Halo APU Power and Memory

Let’s give numbers to the last sentence. The Zen 5 CCD chiplets, that is, CCD0 and CCD1, will eat up a maximum of 15W each or 30W combined. The IOD of the RDNA 3.5 iGPU and the IO controllers is rated at 72W. Then, the SO-DIMM memory comes in at 13W. Add all those numbers up and we get the total figure of 115W of power consumption. But note that the memory is not designed to be on-package but has the standard SO-DIMM placement that is available in either 32GB or 128GB options.

It is not only leaks that tell us details of the AMD Strix Halo APU for us but AMD itself has released some information. The officials say that the FP11 socket will be featured on this APU, with three configurations available: 55W, 85W, and 120W. You, the buyer, will have the choice to mix and match any of these configurations with 32GB (+5-9W) going up to 128 GB (+10-12W) of memory. The Strix Halo will support both SO-DIMM and LPDDR5X memory types. The speed will go up to 8533 MT/s with 256-bit channels.

The iGPU, RDNA 3.5 with up to 40 compute units, is on par with the Intel Raptor Lake and NVIDIA GeForce RTX 4070 (GN21) chip, both of which come in 115W solutions.

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AMD Strix Halo APU in 2025 ASUS ROG Flow Z13

According to the leak, the AMD Strix Halo APU will be featured in the 2025 ASUS ROG Flow Z13, which is both a tablet and a laptop. This version is riddled with brand-new solutions. A thermal enhancement like a Vapor Chamber with 1.3 mm thickness, two 2000 RPM cooling fans, redirected ventilation, and harnessing all of the AMD Strix Halo APU’s 120W power rating in a 13-inch version are some of them.

Here is a detailed description of the cooling components.

  • Cooling fans: The CPU and GPU fans are 7 mm high, with 6.3 and 6.1 CFM respectively, and are almost 2000 RPM faster than previous versions.
  • Airflow and ventilation: A 12V fan with a 2.27 mm air layer between the PCB and the bottom of the case along with nameplate holes for a firmer temperature control.
  • Vapor Chamber: Made with aluminum fins and a stainless steel SUS304 body, it is 1.3 mm thick and 10-22% lighter than previous versions.
  • Thermal management: The flow field is optimized with mylar and sponges and the battery temperature stabilizes below 41 deg. C during dual burns.
  • Surace temperature burns: The touch screen will be below 48 deg. C and the bottom case will be below 50 deg. C.
  • Acoustics: The noise level will be 45 dBA during dual burns.

The AMD Strix Halo APUs will be released in 2025, as will lots of Zen 5 mobile devices, like Fire Range and Krackan Point. As the year progresses, we will see the incorporation of this CCD into a variety of laptops, mini PCs, tablets, and handheld devices.

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